建业科技电子（惠州）有限公司
Kin Yip Technology Electronics (Huizhou) Co.,Ltd
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PTFE material board
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Metal substrate production
Back drill
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技术说明
通过钻掉多余孔铜，避免信号绕路传输，降低型号干扰，我司采用高精度的设备和特殊的控制方法，达到行业领先水平。
技术说明 通过钻掉多余孔铜，避免信号绕路传输，降低型号干扰，我司采用高精度的设备和特殊的控制方法，达到行业领先水平。
