建业科技电子（惠州）有限公司
Kin Yip Technology Electronics (Huizhou) Co.,Ltd
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高密度互联制造，通过微型过孔（包含镭射钻孔、埋孔）实现任意层互联，线宽/线距一般≤3mil，大大的提高了PCB板的集成度，我司现在批量生产“1+N+N”的HDI高端盲埋孔板。
高密度互联制造，通过微型过孔（包含镭射钻孔、埋孔）实现任意层互联，线宽/线距一般≤3mil，大大的提高了PCB板的集成度，我司现在批量生产“1+N+N”的HDI高端盲埋孔板。
